1 aos semiconductor product reliability report AOD2922 , rev a plastic encapsulated device alpha & omega semiconductor, inc www.aosmd.com
2 this aos product reliability report summarizes the qualification result for AOD2922 . accelerated environmental tests are performed on a specific sample size, and then followed by electrical test at end point. review of final electrical test result confirms that AOD2922 passes aos quality and reliability requirements. the released product will be categorized by the process family and be routine monitored for continuously improving the product quality. table of contents: i. product description ii. package and die information iii. reliability stress test summary and result s iv. reliability evaluation i. product description: ? latest trench power alphamos ( mos mv) technology ? very low r ds(on) ? low gate charge ? optimized for fast - switching applications ? rohs and halogen - free compliant details refer to the datasheet. ii. die / package information: AOD2922 process standard sub - micron 100v n - channel alpha mos package type to252 lead frame bare cu die attach soft solder bond al & cu wire mold material epoxy resin with silica filler moisture level up to level 1
3 iii. reliability stress test summary and resul ts ** note : the reliability data presents total of available generic data up to the published date. iv. reliability evaluation fit rate (per billion): 4.90 mt t f = 2 3277 years the presentation of fit rate for the individual product reliability is restricted by the actual burn - in sampl e size . failure rate determination is based on jedec standard jesd 85. fit means one failure per billion hours. failure rate = chi 2 x 10 9 / [ 2 (n) (h) (af) ] = 4.90 mt t f = 10 9 / fit = 23277 years chi2 = chi squared distribution, determined by the number of failures and confidence interval n = total nu mber of units from burn - in tests h = duration of burn - in testing af = acceleration factor from test to use conditions (ea = 0.7ev and tuse = 55 c ) acceleration factor [ af ] = exp [ea / k (1/tj u C 1/tj s )] acceleration factor ratio list: 55 deg c 70 deg c 85 deg c 100 deg c 115 deg c 130 deg c 150 deg c af 25 9 87 32 13 5.64 2.59 1 tj s = stressed junction temperature in degree (kelvin), k = c+273.16 tj u =the use junction temperature in degree (kelvin), k = c+273.16 k = boltz m anns constant, 8.6 17164 x 10 - 5 e v / k test item * test condition time point total sample s ize ** number of failures reference standard msl precondition 168hr 85 c / 85%rh + 3 cycle reflow@260 c (msl 1) - 3003 pcs 0 jesd22 - a113 htgb temp = 150 c , vgs=100% of vgsmax 168 / 500 / 1000 hrs 539 pcs 0 jesd22 - a108 htrb temp = 150 c , vds=80% of vdsmax 168 / 500 / 1000 hrs 539 pcs 0 jesd22 - a108 hast 130 c , 85% rh , 33.3 psi, v d s = 8 0% of v d s max before arcing (typically 42v) 96 hrs 924 pcs 0 jesd22 - a110 pressure pot 121 c , 29.7psi , rh=100% 96 hrs 924 pcs 0 jesd22 - a102 temperature cycle - 65 c to 150 c , air to air, 250 / 500 cycles 1155 pcs 0 jesd22 - a104
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